• Black aluminium chassis with plastic front panel
  Gaming style front panel with software controlled RGB-LED lighting
  Kensington Security Slot at the back panel (also called K-Slot
  or Kensington lock) as a part of an anti-theft system
  Dimensions without the 7 mm rubber feet:
  348.4 x 215.4 x 190.2 mm (LWH), 14.3-litre
  Weight: 3.5 kg net / 5.0 kg gross

• Storage bays: 4 x 3.5″ (internal)
  Using the optional accessory PHD3 two 2.5″ drives can be installed into one 3.5″ bay

• Shuttle Mainboard “FZ270”, Shuttle Form Factor
  proprietary design for XPC cube Barebone SZ270R9
  Dimensions: 270 x 195 mm
  Chipset: Intel® Z270 Chipset, code name “Union Point”
  Platform Controller Hub (PCH) as Single-Chip-Solution
  Solid Capacitors for sensitive areas provide excellent
  heat resistance for enhanced system durability

• AMI BIOS, SPI Interface, 32 MBit Flash-ROM with SPI interface
  Supports PnP, ACPI 3.0, Hardware Monitoring
  Supports Unified Extensible Firmware Interface (UEFI)
  Supports boot-up from external USB flash memory

• Built-in 500 Watt mini switching power supply (PC63J)
  AC input voltage: supports 100~240V, 50~60 Hz
  80 PLUS Silver compliant: the PSU provides at least
  85/89/85% of efficiency at 20/50/100% of load.
  Active PFC circuit (Power Factor Correction)
  ATX main power connectors: 2x 10 and 2x 2-pin
  Graphics power connector: 6-pin and 8-pin
  Other connectors: 4x SATA, 2x Molex, 1x Floppy

• This system comes without operating system.
  It is compatible with Windows 7 / 10 and Linux (64-bit).
  Note: Windows 7 is only supported in combination with 6th generation Intel Core
  processors “Skylake”.
  Additional note on Windows 7 see [7]

• Socket LGA 1151 (H4) supports
  Intel Core i7 / i5 / i3, Pentium and Celeron processors
  – 6th generation, code name “Skylake”
  – 7th generation, code name “Kaby Lake”
  Maximum supported processor power consumption (TDP) = 95 W
  14 nm process technology, up to 8 MB of L3 cache
  Not compatible with Intel Xeon E3 V5 processors for socket LGA 1151 and processors
  with the older Socket LGA 1150.
  Supports the unlock function of Intel K-Series processors.
  The processor integrates PCI-Express, memory controller and the graphics engine on
  the same die (performance features depending on processor type)
  Please refer to the support list for detailed processor support information at
  global.shuttle.com.

• Shuttle I.C.E. (Integrated Cooling Engine)
  Advanced I.C.E. Heatpipe technology with 4 pipes
  Temperature controlled 92 mm fan
  SilentX cooling and noise reduction technology with Active Airflow

• 4 x 288-pin slot
  Supports DDR4-2133/2400 memory (PC4-17066/19200) at 1.2V
  Supports 2+2 Dual Channel mode
  Supports max. 16 GB per DIMM, maximum total size of 64 GB

• The features of the integrated Intel HD graphics function
  depend on the processor type used.
  Supports DirectX 12, OGL 5.x, OCL 2.x
  The PC features three digital video outputs:
  – HDMI v1.4b (supports 1080p/60 and 2160p/30)
  – 2x DisplayPort v1.2 (support 1080p/60 and 2160p/60)
  Supports displays with 4K Ultra HD resolution at 3840 x 2160 [3]
  Supports three independent Full HD displays with the integrated graphics function
  Supports more displays in combination with a discrete graphics card [2]
  Supports Blu-ray (BD) playback with HDCP copy protection
  Supports multi-channel digital audio over the same cable
  Maximum shared memory of 512 MB

1x PCI-Express x16 v3.0 slot (PEG, for graphics cards only)
1x PCI-Express x4 v3.0 slot
This XPC supports dual-slot (double-width) graphics cards. Using one will occupy the
second PCI-Express slot.
The length of the graphics cards can be up to 280 mm
or 273 mm, if the power connectors are on the back side.
Graphics power connectors: 6-pin and 8-pin

• The mainboard provides two M.2 2280 slots with the following interfaces:
  – PCI-Express Gen. 3.0 X4 with up to 32 Gbps Data Transfer Speed
  – SATA v3.0 (max. 6 Gbps)
  It supports M.2 cards with a width of 22 mm
  and a length of 42, 60 or 80 mm (type 2242, 2260, 2280).
  Supports M.2 SSDs with SATA or PCI-Express interface.
  Prepared for Intel® Optane™ Technology.

• The SZ270R9 supports Intel® Optane™ Technology
  which accelerates the speed of one hard disk through data caching.
  This requires a 7th gen. Intel Core processor (“Kaby Lake”)
  and an Optane-SSD with 3D-Xpoint memory (e.g. in M.2 format).

• Interfaces: PCI-Express Gen. 2.0 X1 and USB 2.0
  Supports M.2 cards with a width of 22 mm and a length of 30 mm (type 2230)
  Supports WLAN expansion cards (optional Shuttle accessory WLN-M [6])

• High Definition Audio with Realtek ALC662 codec
  Back panel: three analog audio connectors (3.5 mm):
  Line-in (blue), line-out (green) and microphone input (pink)
  shared with 5.1 channel line-out (front, rear, center/bass)
  Front panel: microphone input and headphones output
  7.1 channel Digital Audio: via HDMI and DisplayPort outputs

• Dual network with two RJ45 ports
  2x Intel i211 Ethernet Controller with MAC, PHY and PCIe interface
  Supports 10 / 100 / 1.000 MBit/s operation
  Supports WAKE ON LAN (WOL)
  Supports network boot by Preboot eXecution Environment (PXE)

• The mainboard provides five Serial-ATA 3.0 interfaces, max. 6 Gbps supported
  4x Serial ATA connector onboard
  Supports Intel Rapid Storage Technology (RST, Raid 0/1/5/10, JBOD)

• Microphone input
  Headphones output (line-out)
  2x USB 3.0
  Power button with Power indicator (blue LED)
  Turbo button to activate overclocking mode [8]
  Front RGB-LED lighting (configurable with Shuttle OC-Tool)

• 1x HDMI v1.4b
  2x DisplayPort v1.2 [4]
  4x USB 3.0
  4x USB 2.0
  2x Gigabit LAN (RJ45)
  3x Audio 3.5 mm (Line-in, Line-out, Microphone-in)
  Clear CMOS button
  Optional: 1x Serial port RS-232 (Accessory: H-RS232)
  3x perforation for optional WLAN antennas (Accessory: WLN-M)

• 2x USB 2.0 (2x 5-pin)
  1x RS232 (2x 5-pin) for optional accessory H-RS232
  2x fan connector (4-pin), both connectors are occupied
  Occupied front connectors: USB 3.0, USB 2.0, audio, power buttons, LEDs

• Multi-language XPC Installation Guide (EN, DE, FR, ES, JP, KR, SC, TC)
  32/64-bit driver disk for Windows
  4x Serial ATA cables
  AC Power Cord (with protective-earth contacts)
  Heatsink Compound
  Protector cap for the CPU socket (do not use if heatpipe or fan is mounted)
  Bag with screws

PHD3: 3.5″ to 2.5″ adapter
H-RS232: Backpanel COM port adapter for RS232 serial interface
WLN-M: Wireless LAN 802.11ac + BT4.0 module with two external antennas [6]

• Operating temperature range: 0~40 °C
  Relative humidity range: 10~90 % (non-condensing)

• EMI: FCC, CE, BSMI, C-Tick
  Safety: ETL, CB, BSMI
  Other: RoHS, Energy Star, ErP
  This device is classed as a technical information equipment (ITE) in class B and is
  intended for use in living room and office. The CE-mark approves the conformity by the
  EU directives:
  (1) 2004/108/EC relating to electromagnetic compatibility (EMC),
  (2) 2006/95/EC relating to Electrical Equipment designed for use within certain voltage
  limits (LVD),
  (3) 2009/125/EC relating to ecodesign requirements for energy-related products (ErP)